Ceramic multilayer wiring substrate and module including the same

ABSTRACT

A module includes a multilayer body including laminated ceramic green sheets that have been fired, multiple mounting terminals arranged to mount a component thereon, the mounting terminals each including an end surface that is exposed at a main surface of the multilayer body, and multiple via conductors disposed inside the multilayer body so as to correspond to the mounting terminals at positions overlapped by the corresponding mounting terminals when viewed in a plan view. The lengths of the via conductors are adjusted so that predetermined points on the mounting terminals are positioned on the same plane.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a ceramic multilayer wiring substrate including a via conductor disposed therein and a module in which a component is mounted on the ceramic multilayer wiring substrate.

2. Description of the Related Art

As illustrated in FIG. 7, a module in which a component, such as an integrated circuit (IC), is flip-chip mounted on one main surface of a ceramic multilayer wiring substrate is currently known (see Japanese Unexamined Patent Application Publication No. 2005-191134, particularly, paragraphs [0036] and [0037], FIG. 1, and other portions). The module 100 includes a ceramic multilayer wiring substrate 101 and a component 103, such as an IC. The ceramic multilayer wiring substrate 101 is a multilayer body that includes laminated ceramic insulating layers 101 a each including a surface on which a wiring pattern 102 is formed. The component 103 is flip-chip mounted on a first main surface of the ceramic multilayer wiring substrate 101. In addition, multiple mounting terminals 106 a to 106 e for allowing the component 103 to be mounted thereon are formed on the first main surface of the ceramic multilayer wiring substrate 101 while multiple external electrodes 105 for connection to external devices are formed on a second main surface of the ceramic multilayer wiring substrate 101. Inside the ceramic multilayer wiring substrate 101, multiple via conductors 104 are formed so as to connect wiring patterns 102 of different ceramic insulating layers 101 a together.

A ceramic multilayer wiring substrate, such as the ceramic multilayer wiring substrate 101, is typically formed in the following manner. Firstly, multiple ceramic green sheets are prepared by forming sheets from a slurry, which is a mixture of materials, such as alumina and glass, in powder form, an organic binder, a solvent, and other components, and then forming via holes at predetermined positions of the ceramic green sheets by a method, such as laser processing. Subsequently, the via holes are filled with a conductor paste containing materials, such as Ag or Cu, to form via conductors 104 for interlayer connection and various wiring patterns 102 are printed on the sheets with the conductor paste. Thereafter, the ceramic green sheets are laminated together into a multilayer body and the multilayer body is pressed at a predetermined pressure and fired at a predetermined temperature to fabricate a ceramic multilayer wiring substrate 101.

Here, the ceramic green sheets and the via conductors 104 have different heat shrinking characteristics. For example, when the above-described multilayer body is fired, the thickness of the ceramic multilayer wiring substrate 101 may vary between the areas in which the via conductors 104 are disposed and the areas in which the via conductors 104 are not disposed when the ceramic multilayer wiring substrate 101 is viewed in a plan. Specifically, the ceramic green sheets have a higher shrinking characteristic than the via conductors 104. Thus, the sheets have a smaller thickness in the areas in which the via conductors 104 are not disposed than in the areas in which the via conductors 104 are disposed. The areas on the top surface of the ceramic multilayer wiring substrate 101 in which the via conductors 104 are disposed when viewed in a plan consequently rise. The amount by which the areas rise increases as the total length of the via conductors 104 disposed in the areas of the top surface when viewed in a plan increases.

In the existing module 100 illustrated in FIG. 7, the total length of the via conductors 104 disposed below the mounting terminal 106 a (see the arrow a) at the middle among the mounting terminals 106 a to 106 e is longer than the total length of the via conductors 104 disposed below each of the other mounting terminals 106 b to 106 e (see the arrows b to e). Thus, if the ceramic multilayer wiring substrate 101 is fabricated by the above-described typical method, the middle mounting terminal 106 a has a height in the stacking direction greater than heights of the other mounting terminals 106 b to 106 e. When, as in the above-described case, the mounting terminals 106 a to 106 e are not positioned on the same plane, the component 103 may be defectively mounted on the ceramic multilayer wiring substrate 101, the component 103 mounted on the ceramic multilayer wiring substrate 101 may become unstable and misaligned at the time of connection, or some of the mounting terminals 106 a to 106 e and the corresponding terminals of the component 103 may fail to be connected due to poor solder wettability.

SUMMARY OF THE INVENTION

Preferred embodiments of the present invention provide a ceramic multilayer wiring substrate that includes via conductors disposed inside the ceramic multilayer wiring substrate and that significantly reduces or prevents defects in mounting a component on one main surface of the ceramic multilayer wiring substrate.

A ceramic multilayer wiring substrate according to a preferred embodiment of the present invention includes a multilayer body including laminated ceramic green sheets that have been fired, at least three mounting terminals configured to mount a component thereon, the mounting terminals each including an end surface that is exposed at a first main surface of the multilayer body, and multiple via conductors disposed inside the multilayer body so as to correspond to the mounting terminals at positions overlapped by the corresponding mounting terminals when viewed in a plan view. The lengths of the via conductors are adjusted so that predetermined points on the exposed end surfaces of the mounting terminals are positioned on the same plane.

Adjustment of the lengths of the via conductors in this manner enables the predetermined points on the end surfaces of the mounting terminals exposed at the first main surface of the multilayer body to be positioned on the same plane, the mounting terminals enabling a component to be mounted thereon. In the case, for example, in which an IC including multiple external terminals, arranged in an array on the circuit surface of the IC, for connection with the ceramic multilayer wiring substrate, is used as a component and is flip-chip mounted on the ceramic multilayer wiring substrate, the external terminals of the IC are disposed on the circuit surface, that is, on the same plane. In such a case, if the predetermined points on the end surfaces of the mounting terminals on the ceramic multilayer wiring substrate are positioned on the same plane at the time of mounting the IC on the ceramic multilayer wiring substrate, the IC is mounted on the first main surface of the ceramic multilayer wiring substrate such that the plane defined by the predetermined points and the plane (circuit surface) defined by the external terminals of the IC are parallel or substantially parallel to each other. Here, the distances between the mounting terminals and the external terminals of the IC corresponding to the mounting terminals is equal or approximately equal to one another, thus significantly reducing or preventing defects in mounting the component, such as component misalignment or poor solder wettability, that can occur due to misalignment of some of the mounting terminals from the same plane.

Moreover, since the via conductors are disposed at positions overlapped by the corresponding mounting terminals when viewed in a plan view, the areas of the first main surface of the ceramic multilayer wiring substrate in which the mounting terminals are disposed rise. Here, at the time of mounting a component on the ceramic multilayer wiring substrate, the areas of the first main surface of the ceramic multilayer wiring substrate overlapped by the component when viewed in a plan view and in which the mounting terminals are not provided are lower in the stacking direction than the areas in which the mounting terminals are disposed. In these areas in which the mounting terminals are not provided, a distance between the component and the ceramic multilayer wiring substrate is increased. Thus, the space between the component and the first main surface of the ceramic multilayer wiring substrate is easily filled with an underfill resin, thus improving the efficiency with which the space is filled with the underfill resin. This configuration improves the reliability of connection between the ceramic multilayer wiring substrate and the component and significantly reduces or prevents solder splash, in which, when the solder that connects an external terminal of the component to the corresponding mounting terminal of the ceramic multilayer wiring substrate is remelted, the remelted solder flows to an adjacent mounting terminal and short-circuits the mounting terminals adjacent to each other.

The mounting terminals may preferably be arranged in a line and the lengths of the corresponding via conductors may sequentially increase in the order in which the corresponding mounting terminals are arranged. In this configuration, the mounting terminals have heights in the stacking direction that increase in the order in which the corresponding mounting terminals are arranged. Thus, when the via conductors disposed at positions overlapped by the mounting terminals when viewed in a plan have different lengths, the predetermined points on the exposed end surfaces of the mounting terminals are easily positioned on the same plane. Consequently, a ceramic multilayer wiring substrate that is less likely to include a defectively mounted component is provided.

The distance between adjacent two of the via conductors and the difference in length between the adjacent via conductors may preferably be substantially proportional to each other. This configuration enables the predetermined points on the exposed end surfaces of the mounting terminals to be reliably positioned on the same plane, thus more effectively reducing or preventing defects in mounting the component.

The lengths of the via conductors may preferably be the same or substantially the same as each other. This configuration enables the predetermined points on the exposed end surfaces of the mounting terminals to be positioned on the same plane as well as at the same height in the stacking direction, thus more effectively reducing or preventing defects in mounting the component.

At least one of the via conductors may preferably be separated into multiple separate via conductors so as to be spaced apart in a stacking direction inside the multilayer body. This configuration enables each of the separate via conductors to connect together predetermined ones of wiring electrodes of different layers disposed in the multilayer body, such that wiring electrodes (including via conductors) that are to be provided in the multilayer body can be more freely designed.

At least one of the separate via conductors may preferably be a dummy conductor that is not connected to another conductor. This configuration enables adjustment of the lengths of the via conductors using the dummy conductor of the separate via conductor so that the predetermined points on the exposed end surfaces of the mounting terminals can be positioned on the same plane. This configuration has no restriction on the length of the via conductors, such as, a restriction that a via conductor has to be lengthened in order to have a predetermined length as in the case in which one via conductor connects predetermined wiring electrodes of different layers. Thus, wiring electrodes (including via conductors) that are to be provided in the ceramic multilayer wiring substrate can be more freely designed.

At least one of the mounting terminals may preferably be an end surface of the corresponding via conductor that is exposed at the first main surface of the multilayer body. For example, in a configuration in which mounting terminals are provided on the first main surface of the ceramic multilayer wiring substrate to enable a component to be mounted thereon and connected to the via conductors disposed immediately under the mounting terminals, arranging the mounting terminals at a narrow pitch is difficult. This is because each mounting terminal is configured so as to have an area, in a plan view, larger than the area of the end surface of the corresponding one of the via conductors in view of the accuracy of the position at which the mounting terminal is disposed or the strength of connection with the component. As a result, the end surfaces of the via conductors that are exposed at the first main surface of the multilayer body are used as the mounting terminals, so that the mounting terminals can be arranged at a narrow pitch. The ceramic multilayer wiring substrate can thus be significantly reduced in size.

A module according to a preferred embodiment of the present invention includes the above-described ceramic multilayer wiring substrate and a component including multiple external terminals. The external terminals of the component are directly connected to the mounting terminals. Here, the configuration in which the external terminals of the component are directly connected to the mounting terminals is a configuration, for example, in which a component is flip-chip mounted. In such a case, the above-described mounting defects, such as component misalignment or poor solder wettability, are more likely to occur due to the difference in height of the mounting terminals in the stacking direction. In view of this, a component is mounted on the above-described ceramic multilayer wiring substrate while the external terminals of the component are directly connected to the mounting terminals of the ceramic multilayer wiring substrate. Thus, a module that is less likely to include a defectively mounted component is provided.

According to another preferred embodiment of the present invention, a ceramic multilayer wiring substrate includes a ceramic multilayer body including laminated ceramic green sheets that have been fired, at least three mounting terminals configured to mount a component thereon, the mounting terminals being disposed at a first main surface of the multilayer body, and at least three interlayer connectors disposed inside the multilayer body so as to correspond to the mounting terminals, the interlayer connectors each including a via conductor. The lengths of the via conductors of the interlayer connectors are adjusted so that the interlayer connectors are disposed at positions overlapped by the corresponding mounting terminals when viewed in a plan view and the mounting terminals are positioned on the same plane.

When, for example, a component having multiple external terminals positioned on the same plane is to be flip-chip mounted on a ceramic multilayer wiring substrate, the component, after being mounted on the ceramic multilayer wiring substrate, is disposed on the first main surface of the ceramic multilayer wiring substrate while the plane defined by the predetermined points on the end surfaces of the mounting terminals of the ceramic multilayer wiring substrate and the plane defined by the external terminals of the component are parallel or substantially parallel to each other. In this case, the distances between the mounting terminals and the external terminals of the component corresponding to the mounting terminals become equal or substantially equal to one another. This configuration significantly reduces or prevents defects in mounting the component, such as component misalignment or poor solder wettability, that can occur due to misalignment of some of the mounting terminals from the same plane.

The above and other elements, features, steps, characteristics and advantages of the present invention will become more apparent from the following detailed description of the preferred embodiments with reference to the attached drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view of a module according to a first preferred embodiment of the present invention.

FIG. 2 is a plan view of a ceramic multilayer wiring substrate included in the module of FIG. 1.

FIG. 3 is an enlarged diagram of a portion of the module of FIG. 1 viewed in a cross section.

FIG. 4 illustrates mounting terminals provided on a ceramic multilayer wiring substrate according to a modified example of a preferred embodiment of the present invention.

FIG. 5 is a cross-sectional view of a module according to a second preferred embodiment of the present invention.

FIG. 6 is a cross-sectional view of a module according to a third preferred embodiment of the present invention.

FIG. 7 is a cross-sectional view of an existing module.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS First Preferred Embodiment

Referring now to FIGS. 1 to 3, an example of a module 1 according to a first preferred embodiment of the present invention will be described. FIG. 1 is a cross-sectional view of a module 1 according to a first preferred embodiment, FIG. 2 is a plan view of a ceramic multilayer wiring substrate included in the module 1, and FIG. 3 is an enlarged diagram of a portion of the module 1 of FIG. 1 viewed in a cross section and illustrates a via conductor 6 a 1 and a portion of the multilayer body 4 surrounding the via conductor 6 a 1. FIG. 1 is a cross section taken along the line A-A of FIG. 2.

As illustrated in FIGS. 1 and 2, the module 1 according to the first preferred embodiment includes a ceramic multilayer wiring substrate 2 and a component 3, and defines, for example, a high-frequency circuit module.

The ceramic multilayer wiring substrate 2 includes a multilayer body 4 including multiple laminated ceramic green sheets that have been fired, multiple mounting terminals 5 a 1 to 5 a 4, 5 b 1 to 5 b 4, and 5 c 1 to 5 c 4 disposed on a first main surface 4 a of the multilayer body 4 including end surfaces that are exposed to enable a component to be mounted thereon, and multiple via conductors 6 a 1 to 6 a 4, 6 b 1 to 6 b 4, and 6 c 1 to 6 c 4 disposed inside the multilayer body 4 so as to correspond to the mounting terminals 5 a 1 to 5 a 4, 5 b 1 to 5 b 4, and 5 c 1 to 5 c 4, the multiple via conductors 6 a 1 to 6 a 4, 6 b 1 to 6 b 4, and 6 c 1 to 6 c 4 being respectively disposed at positions overlapped by the corresponding mounting terminals 5 a 1 to 5 a 4, 5 b 1 to 5 b 4, and 5 c 1 to 5 c 4 when viewed in a plan view.

Inside the multilayer body 4, multiple via conductors 6 d to 6 f are provided at positions not overlapped by the mounting terminals 5 a 1 to 5 a 4, 5 b 1 to 5 b 4, and 5 c 1 to 5 c 4 when viewed in a plan view. Various wiring electrodes 7 are also provided in the multilayer body 4. Multiple external electrodes 8 are provided for connection to external devices on a second main surface 4 b of the multilayer body 4. In this preferred embodiment, the mounting terminals 5 a 1 to 5 a 4, 5 b 1 to 5 b 4, and 5 c 1 to 5 c 4 are defined by end surfaces of the corresponding via conductors 6 a 1 to 6 a 4, 6 b 1 to 6 b 4, and 6 c 1 to 6 c 4 that are exposed at the first main surface 4 a of the multilayer body 4.

A non-limiting example of a method for manufacturing the ceramic multilayer wiring substrate 2 is as follows. Firstly, multiple ceramic green sheets are prepared by forming sheets from a slurry, which is a mixture of materials, such as alumina and glass, in powder form, an organic binder, a solvent, and other components and then forming via holes at predetermined positions of the ceramic green sheets by a method such as laser processing, for example. Subsequently, the via holes are filled with a conductor paste containing materials, such as Ag or Cu, to form via conductors 6 a 1 to 6 a 4, 6 b 1 to 6 b 4, 6 c 1 to 6 c 4, and 6 d to 6 f for interlayer connection and various wiring electrodes 7 are printed on the sheets with the conductor paste. Thereafter, the ceramic green sheets are laminated together into a multilayer body 4 and the multilayer body 4 is pressed at a predetermined pressure and fired at a predetermined temperature to produce a ceramic multilayer wiring substrate 2.

In the case where the ceramic multilayer wiring substrate 2 is fabricated in this manner, at the time of firing the above-described multilayer body, the thickness of the ceramic multilayer wiring substrate 2 varies between the areas in which the via conductors 6 a 1 to 6 a 4, 6 b 1 to 6 b 4, 6 c 1 to 6 c 4, and 6 d to 6 f are disposed and the areas in which the via conductors 6 a 1 to 6 a 4, 6 b 1 to 6 b 4, 6 c 1 to 6 c 4, and 6 d to 6 f are not disposed when viewed in a plan view. This is because the ceramic green sheets and the via conductors 6 a 1 to 6 a 4, 6 b 1 to 6 b 4, 6 c 1 to 6 c 4, and 6 d to 6 f have different heat shrinking characteristics.

Specifically, the heat shrinking characteristic of the ceramic green sheets is higher than that of the via conductors 6 a 1 to 6 a 4, 6 b 1 to 6 b 4, 6 c 1 to 6 c 4, and 6 d to 6 f. Thus, the areas in which the via conductors 6 a 1 to 6 a 4, 6 b 1 to 6 b 4, 6 c 1 to 6 c 4, and 6 d to 6 f are not disposed have a smaller thickness than the areas in which the via conductors 6 a 1 to 6 a 4, 6 b 1 to 6 b 4, 6 c 1 to 6 c 4, and 6 d to 6 f are disposed. Consequently, the areas of the first main surface 4 a of the ceramic multilayer wiring substrate 2 (multilayer body 4) in which the via conductors 6 a 1 to 6 a 4, 6 b 1 to 6 b 4, 6 c 1 to 6 c 4, and 6 d to 6 f are disposed when viewed in a plan view rise. The amount of the rise increases with an increase in length of the via conductors 6 a 1 to 6 a 4, 6 b 1 to 6 b 4, 6 c 1 to 6 c 4, and 6 d to 6 f in the areas in which the via conductors 6 a 1 to 6 a 4, 6 b 1 to 6 b 4, 6 c 1 to 6 c 4, and 6 d to 6 f are disposed when the first main surface 4 a of the ceramic multilayer wiring substrate 2 is viewed in a plan view.

In other words, if the mounting terminals 5 a 1 to 5 a 4, 5 b 1 to 5 b 4, and 5 c 1 to 5 c 4 are end surfaces of the corresponding via conductors 6 a 1 to 6 a 4, 6 b 1 to 6 b 4, and 6 c 1 to 6 c 4 that are exposed at the first main surface 4 a of the multilayer body 4, the mounting terminals 5 a 1 to 5 a 4, 5 b 1 to 5 b 4, and 5 c 1 to 5 c 4 have different heights in the stacking direction depending on the lengths of the corresponding via conductors 6 a 1 to 6 a 4, 6 b 1 to 6 b 4, and 6 c 1 to 6 c 4. In such a case, defects in mounting the component 103 may occur, as described above, the component 103 mounted on the ceramic multilayer wiring substrate 2 may become unstable and misaligned at the time of connection or some of the mounting terminals 5 a 1 to 5 a 4, 5 b 1 to 5 b 4, and 5 c 1 to 5 c 4 and the corresponding external terminals 3 a of the component 3 may fail to be connected due to poor solder wettability.

Thus, in the module 1 according to the first preferred embodiment, the lengths of the via conductors 6 a 1 to 6 a 4, 6 b 1 to 6 b 4, and 6 c 1 to 6 c 4 are adjusted so that predetermined points a1 to a4, b1 to b4, and c1 to c4 at the end surfaces of the via conductors 6 a 1 to 6 a 4, 6 b 1 to 6 b 4, and 6 c 1 to 6 c 4 that are exposed at the first main surface 4 a of the multilayer body 4 to define the mounting terminals 5 a 1 to 5 a 4, 5 b 1 to 5 b 4, and 5 c 1 to 5 c 4 are positioned on the same plane.

Specifically, as illustrated in FIG. 2, the mounting terminals 5 a 1 to 5 a 4, 5 b 1 to 5 b 4, and 5 c 1 to 5 c 4 are arrayed on the first main surface 4 a of the multilayer body 4 into a matrix of four rows and three columns. The corresponding via conductors 6 a 1 to 6 a 4, 6 b 1 to 6 b 4, and 6 c 1 to 6 c 4 are arranged while extending in the stacking direction. For example, the via conductors 6 a 1 to 6 c 1 arranged in a column in the X direction in FIG. 2 are configured so as to sequentially increase in length in the order of the via conductor 6 a 1, the via conductor 6 b 1, and the via conductor 6 c 1, as illustrated in FIG. 1 (A1<B1<C1). Consequently, the mounting electrodes 5 a 1 to 5 c 1 have heights in the stacking direction that increase in the order in which the mounting terminals 5 a 1, 5 b 1, and 5 c 1 are arranged (5 a 1→5 b 1→5 c 1). Here, the predetermined points a1 to a4, b1 to b4, and c1 to c4 in this preferred embodiment are the centers of the end surfaces of the corresponding via conductors 6 a 1 to 6 a 4, 6 b 1 to 6 b 4, and 6 c 1 to 6 c 4 that are exposed at the first main surface 4 a of the multilayer body 4.

In addition, the via conductors 6 a 1 to 6 c 1 are arranged so that the distance between adjacent conductors of the via conductors 6 a 1 to 6 c 1 and the difference in length between the adjacent conductors of the via conductors 6 a 1 to 6 c 1 are proportional or substantially proportional to each other. For example, the lengths of the via conductors 6 a 1 to 6 c 1 are determined so that, when the distance dAB between the via conductors 6 a 1 and 6 b 1 is the same or substantially the same as the distance dBC between the via conductors 6 b 1 and 6 c 1, the difference in length (B1−A1) between the via conductors 6 a 1 and 6 b 1 becomes the same or substantially the same as the difference in length (C1−B1) between the via conductors 6 b 1 and 6 c 1. In other words, the lengths of both via conductors 6 b 1 and 6 c 1 are determined with respect to the via conductor 6 a 1 such that the difference in length from the via conductor 6 a 1 increases as the distance from the via conductor 6 a 1 increases. With this configuration, the predetermined points a1 to c1 of the mounting terminals 5 a 1 to 5 c 1 are linearly or substantially linearly arranged, and the predetermined points a1 to a4, b1 to b4, and c1 to c4 of the mounting terminals 5 a 1 to 5 a 4, 5 b 1 to 5 b 4, and 5 c 1 to 5 c 4 are more likely to be positioned on the same plane.

In this preferred embodiment, the via conductors 6 a 1 to 6 a 4 arranged in a row in the Y direction of FIG. 2 preferably have the same or substantially the same length. The via conductors 6 b 1 to 6 b 4 also preferably have the same or substantially the same length and the via conductors 6 c 1 to 6 c 4 also preferably have the same or substantially the same length. The above-described relationship in length between the via conductors 6 a 1 to 6 a 4, 6 b 1 to 6 b 4, and 6 c 1 to 6 c 4 is merely exemplary and the relationship may be appropriately changed as long as the predetermined points a1 to a4, b1 to b4, and c1 to c4 are adjusted so as to be positioned on the same plane.

For example, the relationship in length between the via conductors 6 a 1 to 6 a 4 arranged in a row in the Y direction of FIG. 2 may preferably be changed so that the via conductors 6 a 1 to 6 a 4 sequentially increase in length in the order of the via conductor 6 a 1, the via conductor 6 a 2, the via conductor 6 a 3, and the via conductor 6 a 4 and, similarly, the via conductors 6 b 1 to 6 b 4 sequentially increase in length in this order and the via conductors 6 c 1 to 6 c 4 sequentially increase in length in this order. Alternatively, the relationship in length between the via conductors 6 a 1 to 6 c 1 arranged in a column in the X direction may preferably be changed so that the via conductors 6 a 1 to 6 c 1 have the same length while the via conductors in each of rows of the via conductors 6 a 1 to 6 a 4, the via conductors 6 b 1 to 6 b 4, and the via conductors 6 c 1 to 6 c 4, arranged in the direction of the Y direction sequentially increase in length.

Since the via conductors 6 a 1 to 6 a 4, 6 b 1 to 6 b 4, and 6 c 1 to 6 c 4 are disposed at positions overlapped by the corresponding mounting terminals 5 a 1 to 5 a 4, 5 b 1 to 5 b 4, and 5 c 1 to 5 c 4 when viewed in a plan view, the mounting terminals 5 a 1 to 5 a 4, 5 b 1 to 5 b 4, and 5 c 1 to 5 c 4 have heights in the stacking direction greater than a height of the first main surface 4 a of the multilayer body 4 (the areas in which the via conductors 6 a 1 to 6 a 4, 6 b 1 to 6 b 4, and 6 c 1 to 6 c 4 are not disposed when viewed in a plan view), as illustrated in FIG. 1. Thus, a distance between the circuit surface on which the external terminals 3 a are disposed and the areas in which the via conductors 6 a 1 to 6 a 4, 6 b 1 to 6 b 4, and 6 c 1 to 6 c 4 are not disposed can be increased, such that the space between the component 3 and the first main surface 4 a of the multilayer body 4 can be efficiently filled with an underfill resin.

Preferably, the component 3 is, for example, a chip component, such as an IC, a chip capacitor, or a chip inductor, made of a material, such as Si or GaAs. The component 3 includes multiple external terminals 3 a corresponding to the mounting terminals 5 a 1 to 5 a 4, 5 b 1 to 5 b 4, and 5 c 1 to 5 c 4 provided on the first main surface 4 a of the multilayer body 4. In this preferred embodiment, an IC is preferably used as a component 3 and is flip-chip mounted.

In FIG. 1, in each of the via conductors 6 a 1 to 6 c 1, not only the end surface (each of the mounting terminals 5 a 1 to 5 c 1) but also a portion of the side surface of the via conductors 6 a 1 to 6 c 1 is exposed above the first main surface 4 a of the multilayer body 4. Alternatively, as in the case of the via conductor 6 a 1 illustrated in FIG. 3, only the end surface (mounting terminal 5 a 1) may preferably be exposed at the first main surface 4 a of the multilayer body 4. In this case, the portion of the side surface of the via conductor 6 a 1 exposed in FIG. 1 is surrounded by a ceramic material of the multilayer body 4 and the first main surface 4 a of the multilayer body 4 gradually rises toward the side surface of the via conductor 6 a 1. The other via conductors 6 a 2 to 6 a 4, 6 b 1 to 6 b 4, and 6 c 1 to 6 c 4 are similarly configured.

According to the above-described preferred embodiment, the lengths of the via conductors 6 a 1 to 6 a 4, 6 b 1 to 6 b 4, and 6 c 1 to 6 c 4 are adjusted so that the predetermined points a1 to a4, b1 to b4, and c1 to c4 of the mounting terminals 5 a 1 to 5 a 4, 5 b 1 to 5 b 4, and 5 c 1 to 5 c 4 provided on the first main surface 4 a of the multilayer body 4 to enable a component to be mounted thereon are positioned on the same plane.

Consequently, when the component 3 that is to be flip-chip mounted is placed on the ceramic multilayer wiring substrate 2 (multilayer body 4), the component 3 is disposed on the first main surface 4 a of the ceramic multilayer wiring substrate 2 (multilayer body 4) such that the plane defined by the predetermined points a1 to a4, b1 to b4, and c1 to c4 of the mounting terminals 5 a 1 to 5 a 4, 5 b 1 to 5 b 4, and 5 c 1 to 5 c 4 provided on the first main surface 4 a of the multilayer body 4 and the circuit surface of the component 3, that is, the plane defined by the external terminals 3 a, is parallel or substantially parallel to each other. Thus, the distances from the mounting terminals 5 a 1 to 5 a 4, 5 b 1 to 5 b 4, and 5 c 1 to 5 c 4 to the external terminals 3 a of the component 3 corresponding to the mounting terminals 5 a 1 to 5 a 4, 5 b 1 to 5 b 4, and 5 c 1 to 5 c 4 are equal or substantially equal. This configuration significantly reduces or prevents the above-described existing defects in mounting the component 3, such as misalignment of the component 3 or poor solder wettability that can occur due to misalignment of some of the mounting terminals 5 a 1 to 5 a 4, 5 b 1 to 5 b 4, and 5 c 1 to 5 c 4 from the same plane.

The mounting terminals 5 a 1 to 5 c 1 are arranged in a column (in the X direction of FIG. 2) and the predetermined points a1 to c1 of the mounting terminals 5 a 1 to 5 c 1 in the stacking direction sequentially increase in height in the order in which the mounting terminals 5 a 1 to 5 c 1 are arranged since the corresponding via conductors 6 a 1 to 6 c 1 sequentially increase in length in the order of the corresponding via conductors 6 a 1 to 6 c 1 are arranged. Thus, even when the via conductors 6 a 1 to 6 c 1 disposed at positions overlapped by the mounting terminals 5 a 1 to 5 c 1 when viewed in a plan view have different lengths, linear disposition of the predetermined points a1 to c1 of the mounting terminals 5 a 1 to 5 c 1 is facilitated, such that the predetermined points a1 to a4, b1 to b4, and c1 to c4 of the mounting terminals 5 a 1 to 5 a 4, 5 b 1 to 5 b 4, and 5 c 1 to 5 c 4 are easily positioned on the same plane. Thus, a ceramic multilayer wiring substrate 2 that is less likely to include a defectively mounted component 3 is provided.

In addition, the length of the via conductors 6 a 1 to 6 c 1 arranged in a column in the X direction of FIG. 2 are determined so that the distance between adjacent two of the via conductors 6 a 1 to 6 c 1 and the difference in length between the adjacent two of the via conductors 6 a 1 to 6 c 1 are proportional or substantially proportional to each other. Thus, the predetermined points a1 to c1 of the mounting terminals 5 a 1 to 5 c 1 are reliably positioned on a straight line, such that the predetermined points a1 to a4, b1 to b4, and c1 to c4 of the mounting terminals 5 a 1 to 5 a 4, 5 b 1 to 5 b 4, and 5 c 1 to 5 c 4 are reliably positioned on the same plane. Consequently, defects in mounting the component 3 are further effectively reduced or prevented.

In this preferred embodiment, the mounting terminals 5 a 1 to 5 a 4, 5 b 1 to 5 b 4, and 5 c 1 to 5 c 4 are the end surfaces of the corresponding via conductors 6 a 1 to 6 a 4, 6 b 1 to 6 b 4, and 6 c 1 to 6 c 4 that are exposed at the first main surface 4 a of the multilayer body 4. In the case of another configuration in which mounting terminals are separately provided on the first main surface 4 a of the ceramic multilayer wiring substrate 2 (multilayer body 4) and connected to the via conductors 6 a 1 to 6 a 4, 6 b 1 to 6 b 4, and 6 c 1 to 6 c 4 immediately under the mounting terminals, arranging the mounting terminals at a narrow pitch is difficult. This is because each mounting terminal is configured to have an area, in a plan view, larger than the area of the end surface of the corresponding one of the via conductors 6 a 1 to 6 a 4, 6 b 1 to 6 b 4, and 6 c 1 to 6 c 4 to accommodate for the accuracy of the position at which the mounting terminal is provided or the strength of connection with the component 3.

In view of this inconvenience, in this preferred embodiment, the end surfaces of the via conductors 6 a 1 to 6 a 4, 6 b 1 to 6 b 4, and 6 c 1 to 6 c 4 that are exposed at the first main surface 4 a of the ceramic multilayer wiring substrate 2 (multilayer body 4) are used as the mounting terminals 5 a 1 to 5 a 4, 5 b 1 to 5 b 4, and 5 c 1 to 5 c 4, so that the mounting terminals 5 a 1 to 5 a 4, 5 b 1 to 5 b 4, and 5 c 1 to 5 c 4 can be disposed at a narrow pitch. Thus, the ceramic multilayer wiring substrate 2 is significantly reduced in size.

The module 1 according to this preferred embodiment is configured such that the component 3 is flip-chip mounted on the ceramic multilayer wiring substrate 2, which is more likely to cause defects in mounting the component 3 if some of the predetermined points a1 to a4, b1 to b4, and c1 to c4 of the mounting terminals 5 a 1 to 5 a 4, 5 b 1 to 5 b 4, and 5 c 1 to 5 c 4 are misaligned away from the same plane. However, the module 1 is less likely to include a defectively mounted component 3 since the lengths of the via conductors 6 a 1 to 6 a 4, 6 b 1 to 6 b 4, and 6 c 1 to 6 c 4 are adjusted so that the predetermined points a1 to a4, b1 to b4, and c1 to c4 of the mounting terminals 5 a 1 to 5 a 4, 5 b 1 to 5 b 4, and 5 c 1 to 5 c 4 of the multilayer body 4 are positioned on the same plane.

Since the via conductors 6 a 1 to 6 a 4, 6 b 1 to 6 b 4, and 6 c 1 to 6 c 4 are disposed at positions overlapped by the corresponding mounting terminals 5 a 1 to 5 a 4, 5 b 1 to 5 b 4, and 5 c 1 to 5 c 4 when viewed in a plan view, the areas of the first main surface 4 a of the ceramic multilayer wiring substrate 2 in which the mounting terminals 5 a 1 to 5 a 4, 5 b 1 to 5 b 4, and 5 c 1 to 5 c 4 are disposed rise. In this case, at the time of mounting the component 3 on the ceramic multilayer wiring substrate 2, the areas within the area of the first main surface 4 a of the ceramic multilayer wiring substrate 2 overlapped by the component 3 when viewed in a plan view and in which the mounting terminals 5 a 1 to 5 a 4, 5 b 1 to 5 b 4, and 5 c 1 to 5 c 4 are not disposed have a height in the stacking direction smaller than the height of the areas in which the mounting terminals 5 a 1 to 5 a 4, 5 b 1 to 5 b 4, and 5 c 1 to 5 c 4 are disposed. Thus, in these areas (the areas in which the mounting terminals 5 a 1 to 5 a 4, 5 b 1 to 5 b 4, and 5 c 1 to 5 c 4 are not disposed), a space between the component 3 and the ceramic multilayer wiring substrate 2 is increased.

This configuration facilitates filling the space between the component 3 and the first main surface 4 a of the ceramic multilayer wiring substrate 2 with an underfill resin, thus improving the efficiency with which the space is filled with the underfill resin. As a result, this configuration improves the reliability of connection between the ceramic multilayer wiring substrate 2 and the component 3 and significantly reduces or prevents solder splash, in which, when the solder that connects an external terminal 3 a of the component 3 to the corresponding one of the mounting terminals 5 a 1 to 5 a 4, 5 b 1 to 5 b 4, and 5 c 1 to 5 c 4 of the ceramic multilayer wiring substrate 2 is remelted, the remelted solder flows to an adjacent one of the mounting terminals 5 a 1 to 5 a 4, 5 b 1 to 5 b 4, and 5 c 1 to 5 c 4 and short-circuits the mounting terminals adjacent to each other.

Modified Example of Mounting Terminal

Referring now to FIG. 4, a modified example of the mounting terminals 5 a 1 to 5 a 4, 5 b 1 to 5 b 4, and 5 c 1 to 5 c 4 according to a preferred embodiment of the present invention is described. FIG. 4 is a plan view of the ceramic multilayer wiring substrate 2 and illustrates the modified example of the mounting terminals 5 a 1 to 5 a 4, 5 b 1 to 5 b 4, and 5 c 1 to 5 c 4.

In the above described preferred embodiment, the mounting terminals 5 a 1 to 5 a 4, 5 b 1 to 5 b 4, and 5 c 1 to 5 c 4 preferably are the end surfaces of the corresponding via conductors 6 a 1 to 6 a 4, 6 b 1 to 6 b 4, and 6 c 1 to 6 c 4 that are exposed at the first main surface 4 a of the multilayer body 4. However, as illustrated in FIG. 4, mounting terminals 9 a 1 to 9 a 4, 9 b 1 to 9 b 4, and 9 c 1 to 9 c 4, which each have a main surface having an area larger than the area of the end surface of each of the corresponding via conductors 6 a 1 to 6 a 4, 6 b 1 to 6 b 4, and 6 c 1 to 6 c 4, may be separately provided on the exposed end surfaces of the corresponding via conductors 6 a 1 to 6 a 4, 6 b 1 to 6 b 4, and 6 c 1 to 6 c 4.

This configuration increases the area over which each mounting terminal and the corresponding external terminal 3 a of the component 3 are connected, and thus, increases the strength of connection between the component 3 and the ceramic multilayer wiring substrate 2. Here, at least one of the mounting terminals 9 a 1 to 9 a 4, 9 b 1 to 9 b 4, and 9 c 1 to 9 c 4 may be separately provided on the corresponding one of the via conductors 6 a 1 to 6 a 4, 6 b 1 to 6 b 4, and 6 c 1 to 6 c 4. In such a case, the predetermined points a1 to a4, b1 to b4, and c1 to c4 of the mounting terminals 9 a 1 to 9 a 4, 9 b 1 to 9 b 4, and 9 c 1 to 9 c 4 preferably are, as illustrated in FIG. 4, respectively positioned at the centers of the end surfaces of the via conductors 6 a 1 to 6 a 4, 6 b 1 to 6 b 4, and 6 c 1 to 6 c 4 corresponding to the mounting terminals 9 a 1 to 9 a 4, 9 b 1 to 9 b 4, and 9 c 1 to 9 c 4 that are exposed above the first main surface 4 a of the multilayer body 4.

Second Preferred Embodiment

Referring to FIG. 5, a module 1 a according to a second preferred embodiment of the present invention will be described. FIG. 5 is a cross-sectional view of the module 1 a.

The module 1 a according to the second preferred embodiment is different from the module 1 according to the first preferred embodiment illustrated in FIG. 1 in that, as illustrated in FIG. 5, the via conductor 6 b 1 among the via conductors 6 a 1 to 6 a 4, 6 b 1 to 6 b 4, and 6 c 1 to 6 c 4 is separated into two separate via conductors 6 b 1 a and 6 b 1 b, which are spaced apart from each other in the stacking direction of the multilayer body 4. The remaining portions of this configuration preferably are the same or substantially the same as those in the module 1 according to the first preferred embodiment and are, thus, denoted by the same reference symbols without being described.

Here, the via conductor 6 b 1 disposed in the area overlapped by the mounting terminal 5 b 1 when viewed in a plan view includes two separate via conductors 6 b 1 a and 6 b 1 b. Among the via conductors 6 d to 6 f, illustrated in FIG. 1, disposed in the areas not overlapped by the mounting terminals 5 a 1 to 5 a 4, 5 b 1 to 5 b 4, and 5 c 1 to 5 c 4 when viewed in a plan view, a via conductor 6 g is provided instead of the via conductor 6 e. The end surface of the separate via conductor 6 b 1 a that is exposed at the first main surface 4 a of the multilayer body 4 defines the mounting terminal 5 b 1. The separate via conductor 6 b 1 a and the via conductor 6 g, provided instead of the via conductor 6 e, are connected together by the wiring electrode 7 disposed inside the multilayer body 4. Here, the lengths of the separate via conductors 6 b 1 a and 6 b 1 b are determined so that the sum of the lengths of the separate via conductors 6 b 1 a and 6 b 1 b is equal or substantially equal to the length B1 of the via conductor 6 b 1 illustrated in FIG. 1 (B1=B2+B3). The separate via conductor 6 b 1 b is a dummy conductor that is not connected to any electrode in the multilayer body 4.

As described above, the heights of the mounting terminals 5 a 1 to 5 a 4, 5 b 1 to 5 b 4, and 5 c 1 to 5 c 4 (the predetermined points a1 to a4, b1 to b4, and c1 to c4) in the stacking direction depend on the lengths of the via conductors 6 a 1 to 6 a 4, 6 b 1 to 6 b 4, and 6 c 1 to 6 c 4 disposed at positions overlapped by the corresponding mounting terminals 5 a 1 to 5 a 4, 5 b 1 to 5 b 4, and 5 c 1 to 5 c 4 when viewed in a plan view. Thus, the lengths of the via conductors 6 a 1 to 6 a 4, 6 b 1 to 6 b 4, and 6 c 1 to 6 c 4 need to be adjusted to the above-described desired lengths in order that the predetermined points a1 to a4, b1 to b4, and c1 to c4 of the mounting terminals 5 a 1 to 5 a 4, 5 b 1 to 5 b 4, and 5 c 1 to 5 c 4 are positioned on the same plane. On the other hand, since the via conductors 6 a 1 to 6 a 4, 6 b 1 to 6 b 4, 6 c 1 to 6 c 4, 6 d, 6 f, and 6 g function as interlayer connection conductors, restrictions on the length of the via conductors would limit the design of the various wiring electrodes 7 and the via conductors 6 a 1 to 6 a 4, 6 b 1 to 6 b 4, 6 c 1 to 6 c, and 6 d to 6 g, which are disposed inside the multilayer body 4.

In view of this, this preferred embodiment is configured such that the separate via conductor 6 b 1 b, which is not required to be disposed inside the multilayer body 4 for the original purpose, is provided as a dummy conductor so that the desired length B1 of the via conductor 6 b 1 can be obtained. This configuration enables a reduction of defects in mounting the component 3 with adjustment of the lengths of the via conductors 6 a 1 to 6 a 4, 6 b 1 to 6 b 4, and 6 c 1 to 6 c 4 so that the predetermined points a1 to a4, b1 to b4, and c1 to c4 of the mounting terminals 5 a 1 to 5 a 4, 5 b 1 to 5 b 4, and 5 c 1 to 5 c 4 are positioned on the same plane, while the various wiring electrodes 7 and the via conductors 6 a 1 to 6 a 4, 6 b 1 to 6 b 4, 6 c 1 to 6 c 4, 6 d, 6 f, and 6 g, which are disposed inside the multilayer body 4, can be freely designed.

Here, the separate via conductor 6 b 1 b does not necessarily have to be a dummy conductor and may be used for the original purpose as an interlayer connection conductor. Thus, each of the separate via conductors 6 b 1 a and 6 b 1 b connect predetermined wiring electrodes 7 of different layers together. Thus, the via conductors 6 a 1 to 6 a 4, 6 b 1 to 6 b 4, 6 c 1 to 6 c 4, 6 d, 6 f, and 6 g and the various wiring electrodes 7, which are disposed inside the multilayer body 4, are more freely designed. Each of the other via conductors 6 a 1 to 6 a 4, 6 b 1 to 6 b 4, and 6 c 1 to 6 c 4 may preferably be similarly configured into separate via conductors.

Third Preferred Embodiment

Referring now to FIG. 6, a module 1 b according to a third preferred embodiment of the present invention will be described. FIG. 6 is a cross-sectional view of the module 1 b.

The module 1 b according to the third preferred embodiment is different from the module 1 a according to the second preferred embodiment illustrated in FIG. 5 in that, as illustrated in FIG. 6, the via conductors 6 a 1 to 6 a 4, 6 b 1 to 6 b 4, and 6 c 1 to 6 c 4 disposed in the areas overlapped by the corresponding mounting terminals 5 a 1 to 5 a 4, 5 b 1 to 5 b 4, and 5 c 1 to 5 c 4 when viewed in a plan view have the same or substantially the same length. Other portions of the configuration are the same or substantially the same as those in the module 1 a according to the second preferred embodiment and, thus, are denoted by the same reference symbols without being described.

Here, the via conductors 6 a 1 to 6 a 4, 6 b 1 to 6 b 4, and 6 c 1 to 6 c 4 disposed in the areas overlapped by the mounting terminals 5 a 1 to 5 a 4, 5 b 1 to 5 b 4, and 5 c 1 to 5 c 4 when viewed in a plan view have the same or substantially the same length. For example, the via conductors 6 a 1 to 6 c 1 are configured so that, as illustrated in FIG. 6, the via conductor 6 b 1 is separated into two separate via conductors 6 b 1 a and 6 b 1 b as in the case of the module 1 a according to the second preferred embodiment, and so that the sum of the lengths of the separate via conductors 6 b 1 a and 6 b 1 b is equal or substantially equal to the length of each of the via conductor 6 a 1 and the via conductor 6 c 1 (A2=(B2+B3)=C2). Inside the multilayer body 4, a via conductor 6 h is provided instead of the via conductor 6 d and a via conductor 6 i is provided instead of the via conductor 6 f.

This configuration enables the predetermined points a1 to a4, b1 to b4, and c1 to c4 of the mounting terminals 5 a 1 to 5 a 4, 5 b 1 to 5 b 4, and 5 c 1 to 5 c 4 to be positioned on the same plane as well as at the same or substantially the same height in the stacking direction, whereby defects in mounting the component 3 can be more effectively reduced or prevented.

The present invention is not limited to the preferred embodiments described above, and may be modified in various different manners without departing from the spirit of the present invention.

In the module 1 a according to the second preferred embodiment, the via conductor 6 b 1 preferably is separated into two separate via conductors 6 b 1 a and 6 b 1 b. However, the via conductor 6 b 1 may be separated into three or more separate via conductors.

The total number of via conductors and mounting terminals disposed inside the ceramic multilayer wiring substrate 2 is appropriately changeable.

Preferred embodiments of the present invention are applicable to various types of modules in which a component is mounted on a ceramic multilayer wiring substrate including a via conductor inside.

While preferred embodiments of the present invention have been described above, it is to be understood that variations and modifications will be apparent to those skilled in the art without departing from the scope and spirit of the present invention. The scope of the present invention, therefore, is to be determined solely by the following claims. 

What is claimed is:
 1. A module comprising: a ceramic multilayer wiring substrate including: a multilayer body including a plurality of fired laminated ceramic green sheets; at least three mounting terminals configured to mount a component thereon, each of the at least three mounting terminals includes an end surface that is exposed at a main surface of the multilayer body; and a plurality of via conductors disposed inside the multilayer body so as to correspond to the at least three mounting terminals at positions overlapped by corresponding mounting terminals when viewed in a plan view; wherein lengths of the plurality of via conductors are set so that predetermined points on the exposed end surfaces of the at least three mounting terminals are positioned on a same plane; at least three mounting electrodes of the at least three mounting terminals have heights in a stacking direction of the plurality of fired laminated ceramic green sheets that increase in an order in which the at least three mounting terminals are arranged; and a chip component including a plurality of external terminals; wherein the external terminals of the chip component are directly connected to the at least three mounting terminals; and the plane defined by the predetermined points is parallel or substantially parallel to a plane defined by the external terminals of the chip component; the plurality of via conductors include a dummy via conductor; the dummy via conductor is not connected to another conductor and is disposed below one of the plurality of via conductors to maintain a predetermined length; and the predetermined length is equal to or substantially equal to a sum of the length of the dummy via conductor and the length of one of the plurality of via conductors.
 2. The module according to claim 1, wherein the at least three mounting terminals are arranged in a line; and the lengths of the plurality of via conductors sequentially increase in an order in which the corresponding at least three mounting terminals are arranged.
 3. The module according to claim 2, wherein a distance between two adjacent via conductors of the plurality of via conductors and a difference in length between the adjacent via conductors are proportional or substantially proportional to each other.
 4. The module according to claim 1, wherein the lengths of the plurality of via conductors are the same or substantially the same.
 5. The module according to claim 1, wherein at least one of the plurality of via conductors is separated into a plurality of separate via conductors in a stacking direction of the plurality of fired laminated ceramic green sheets inside the multilayer body.
 6. The module according to claim 5, wherein at least one of the separate via conductors is a dummy conductor that is not connected to another conductor.
 7. The module according to claim 1, wherein at least one of the at least three mounting terminals is defined by an end surface of a corresponding one of the plurality of via conductors that is exposed at the main surface of the multilayer body.
 8. The module according to claim 1, wherein all of the at least three mounting terminals are defined by an end surface of corresponding ones of the plurality of via conductors that are exposed at the main surface of the multilayer body.
 9. The module according to claim 1, wherein the predetermined points on the exposed end surfaces of the at least three mounting terminals are approximate centers of the exposed end surfaces.
 10. The module according to claim 1, wherein the plurality of via conductors have the same or substantially the same length.
 11. The module according to claim 1, wherein each of the at least three mounting terminals have heights in a stacking direction of the plurality of fired laminated ceramic green sheets greater than a height of the main surface of the multilayer body.
 12. The module according to claim 1, wherein a portion of side surfaces of each of the plurality of via conductors is exposed above the main surface of the multilayer body.
 13. The module according to claim 1, wherein each of the at least three mounting terminals is separately provided on an end surface of a corresponding one of the plurality of via conductors.
 14. The module according to claim 13, wherein each of the at least three mounting terminals includes a main surface having an area larger than an area of the end surface of the corresponding one of the plurality of via conductors.
 15. The module according to claim 1, wherein an underfill resin is filled between the main surface of the multilayer body and the chip component.
 16. The module according to claim 1, wherein the chip component is one of an IC, a chip capacitor, or a chip inductor.
 17. The module according to claim 1, wherein protrusions extend from the main surface of the multilayer body.
 18. The module according to claim 1, wherein distances from the predetermined points to the external terminals are equal or substantially equal.
 19. The module according to claim 1, wherein the multilayer body further includes wiring electrodes; and an extending direction of one of the wiring electrodes connected to one of the plurality of via conductors is different from an extending direction of another one of the wiring electrodes connected to another one of the plurality of via conductors.
 20. The module according to claim 1, wherein a bottom surface of the chip component is flat or substantially flat when viewed in a side view of the chip component.
 21. The module according to claim 1, wherein the external terminals of the chip component are directly connected to the at least three mounting terminals by solder. 